Chipbond Technology Corporation capitalization
Kakaretso ea kakaretso eohle ea Chipbond Technology Corporation likhakanyo tsa setoko tse fanoeng kajeno ke capitalization ea Chipbond Technology Corporation qotsulo ea setoko. Tlhahisoleseling ea "Class ea Chipbond Technology Corporation e nkuoe mehloling e bulehileng. Chipbond Technology Corporation kajeno ho webosaete ea rona bakeng sa ho buuoa ka eona. Chipbond Technology Corporation cap cap e marakeng kajeno ke $ 48 604 880 896.
Chipbond Technology Corporation boholo ba khoebo
Chipbond Technology Corporation mehloli ea khoebo kajeno = 1 574 329 lidola tsa US. Kajeno, Chipbond Technology Corporation e etsahetse mebarakeng e fapaneng ea metšoasong. Chipbond Technology Corporation Khoebo ea marang-rang e tšoareloang mebarakeng e mengata ea setoko, re bonts'a palo e felletseng ea Chipbond Technology Corporation ka letsatsi. Boleng ba li- stock tsohle tsa Chipbond Technology Corporation metšoasong e fanoeng (Chipbond Technology Corporation cap cap ea mmaraka) e nyolohile ka $ 221 605 888.
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Chipbond Technology Corporation chate ea khamera ea 'maraka
Chipbond Technology Corporation chate ea kh'outu ka lilemo. Phetoho ea Chipbond Technology Corporation ka beke ke -0.75%. 0% ka selemo - phetoho khoebong ea mebaraka ea Chipbond Technology Corporation. Kajeno, Chipbond Technology Corporation e hakanyetsoa ho 48 604 880 896 lidola tsa US.
| Beke | Khoeli | 3 months | Selemo | Lilemo tse 3 |
Chipbond Technology Corporation histori ea lichelete
| Letsatsi |
Capitalization
Capitalization (motlakase oa maraka) ke boleng ba maraka ba likarolo tsohle tsa likhamphani tse rekisoang ka lichelete. Phaello ea lichelete e lekana le theko ea likarolo tse eketsehileng ka palo ea likarolo tse hlahelletseng.
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|---|---|
| 04/05/2023 | 48 604 880 896 $ |
| 03/05/2023 | 48 383 275 008 $ |
| 02/05/2023 | 48 235 544 576 $ |
| 28/04/2023 | 48 678 748 160 $ |
| 27/04/2023 | 49 712 893 952 $ |
| 26/04/2023 | 49 417 424 896 $ |
| 25/04/2023 | 48 974 217 216 $ |
Chipbond Technology Corporation chate ea moqolo
| Beke | Khoeli | 3 months | Selemo | Lilemo tse 3 |
Chipbond Technology Corporation data ea histori ea moqolo
| Letsatsi |
Buka (24h)
Sesebelisoa sa khoebo ea Chipbond Technology Corporation likarolo ke kakaretso ea litšebelisano le likarolo tsa 6147.TWO tse rekiloeng le tse rekisoang ka letsatsi le khethiloeng.
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|---|---|
| 04/05/2023 | 1 574 329 $ |
| 03/05/2023 | 2 559 848 $ |
| 02/05/2023 | 3 222 921 $ |
| 28/04/2023 | 4 082 345 $ |
| 27/04/2023 | 3 653 609 $ |
| 26/04/2023 | 2 177 037 $ |
| 25/04/2023 | 5 953 103 $ |
Chipbond Technology Corporation capitalization e lekantsoe 48 604 880 896 lidola tsa US ho 04/05/2023. Chipbond Technology Corporation capitalization ho 03/05/2023 e lekana le 48 383 275 008 lidola tsa US. Mmaraka oa mebaraka ea Chipbond Technology Corporation ho 02/05/2023 e lekantsoe 48 235 544 576 lidola tsa US. Chipbond Technology Corporation ho 28/04/2023 e lekantsoe 48 678 748 160 lidola tsa US.
Chipbond Technology Corporation e lekana le 49 712 893 952 lidola tsa US ho 27/04/2023. Chipbond Technology Corporation capitalization ho 26/04/2023 e lekana le 49 417 424 896 lidola tsa US. Chipbond Technology Corporation mebaraka ea mebaraka ho 25/04/2023 e lekana le 48 974 217 216 lidola tsa US.
Ts'ebetso ea lichelete tsa Chipbond Technology Corporation kajeno ke 48 604 880 896 $. Matsete a maraka a Chipbond Technology Corporation a fetohile +0.46% ha e bapisoa le maobane. Kakaretso ea khoebo ea 6147.TWO kabelo ea Chipbond Technology Corporation letsatsing la ho qetela la khoebo e bile 1 574 329 $. Likarolo tsa khoebo tsa Chipbond Technology Corporation li fetohile ho -38.499% ha li bapisoa le letsatsi la pele la khoebo.